IEEE-Cpmt International Electronic Manufacturing Technology Symposium

0000-00-00 00:00:00 by IEEE Components Packaging & Manufacturing Technology Society
IEEE-Cpmt International Electronic Manufacturing Technology Symposium by IEEE Components Packaging & Manufacturing Technology Society

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Book Views: 6

Author
IEEE Components Packaging & Manufacturing Technology Society
Publisher
Institute of Electrical & Electronics Engineers(IEEE)
Date of release
Pages
482
ISBN
9780780339293
Binding
Paperback
Illustrations
Format
PDF, EPUB, MOBI, TXT, DOC
Rating
5
21

Book review

The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.


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